Details

The JVX7300HR extends the capabilities of previous High-Resolution X-ray Diffraction (HRXRD) and X-ray Reflectivity (XRR) platforms to meet advanced node challenges.

JVX7300HR delivers full stack analysis with higher throughput, smaller feature dimensions, and improved tool-to-tool matching, as well as enhanced user interface, ease-of-use and lower cost of ownership (COO).

Materials

• Strained silicon process control of HRXRD
  1. SiGe, Si:C epilayers
  2. SOI epitaxy process
• Reporting parameters of: Thickness, composition / strain, and other process quality values such as mosaic and relaxation.
• HKMG stack with XRR
  1. Various stacks of bi or tri-layer metal gates
  2. HKMG full stack study and examination of metal gate and hi-k layers simultaneously
• Reporting parameters of: Thickness, density and roughness of thin layers

Techniques

Combination of advanced High-Resolution X-Ray Diffraction (HRXRD) and X-Ray Reflectivity (XRR) channels to provide characterization and process control of:

Specifications

JVX7300 platform:

• Non destructive, production proven X-ray metrology
• Fully automated 300/200mm, for high volume manufacturing (HVM) use
• SEMI E84, EHT, SECS/GEM automation
• Software adheres to SEMI E95 standard
• Certifications: SEMI S2/S8, CE mark, ISO9001, ISO14001, ISO18001

XRR:

• Convergent beam Fast XRR, high throughput
• Small spot, scribe line metrology capability
• Fully automated recipe driven measurements
• Edge exclusion <1mm
• Automated expert system for procedure setup

HRXRD:

• Convergent beam Fast HRXRD
• Small spot, solid or OCD pads (50µm x 50µm)
• Bulk Si and (FD)SOI capable
• Powerful, world class modeling software