JVX7300F
The JVX7300F is the latest generation X-ray Fluorescence (XRF) tool from Jordan Valley. It includes all features of the JVX6200iF, which is the tool of record at many fabs, and extends the metrology capabilities for advanced micro-bump and Under Bump Metallization (UBM) processes.
The JVX7300F allows the non-destructive thickness, and composition measurement, of smaller features than previous generations of XRF tools with enhanced productivity, improved ease-of-use and maintainability.
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Vertical excitation geometry that allows extremely small beam footprint (<20µm FWHM for Sn and AgKa) with no dependence on wafer height variation.
The tool provides critical thickness and composition information for maintaining excellent process control of metal films and features, such as those found in advanced wafer level packaging (WLP)
The JVX7300F introduces improved algorithms for the fine navigation to small features such as 10µm diameter micro-bumps or 15µm x 15µm pads of UBM stacks
The tool offers advanced performance in terms of throughput, stability, robustness, CoO and it is compatible with future nodes of semiconductor industry
- Micro-bumps (< 20µm) SnAg composition
- UBM and RDL multi-layer analysis (Au, Cu, Ni, Pd, Ti )
- Other metals stacks found in FEOL, MEOL and BEOL processes, for example:
- NiFe
- NiPt
- TiN
- W and Cu (EP/CMP)
- Al
- XRF (X-ray fluorescence): Vertical illumination/detection geometry with poly-capillary optics for an extremely small spot (20µm FWHM)
- XRF offers non-destructive metrology thickness and composition metrology of thin and thick metal, and metal alloy layers
JVX7300 platform:
- Non-destructive, production proven
- Fully automated 300/200mm, for high volume manufacturing (HVM) use
- EFEM, SEMI E84, EHT, SECS/GEM automation
- Software adheres to SEMI E95 GUI standard
- Certifications: SEMI S2/S8, CE marking, ISO9001, ISO14001, ISO18001
XRF:
- Vertical incidence micro-spot XRF
- FWHM of <20µm, no dependence on height variation
- Si(Li) detectors , with superior efficiency for high energies (such as Ag and SnKa )
- Multiple detectors allow photon collection from a large solid angle, giving high throughput, increased precision and insensitivity to feature geometry (e.g. spherical µ-bump)
- Detector proximity and arrangement enables high detection efficiency
- Improved navigation techniques enable sub-micron navigation to single bump center
- Fully automated recipe driven measurement and analysis
- Optic designed for enhanced flux at high energies
- Dead-time optimization by introducing double wheel filters with hundreds of filter combinations
- Automated expert system for easier procedure setup
