JVX6200iF Galaxy
The JVX6200iF Galaxy Production-line proven X-ray metrology platform for μ-bump Sn/Ag composition. Micro spot XRF for Wafer Level Packaging metrology
JVX6200iF features small spot XRF, for robust measurement of complex patterning. JV's technology roadmap is inline with µ-bump scaling and can measure bumps smaller than15µm. JV tools can measure solder cap (~3µm) on top of Cu pillar as single bump.
XRF (X-Ray fluorescence) Thickness, elemental analysis and composition of thin and thick metal layers for the FEOL, BEOL and WLP
- High brightness XRF source with high efficiency detector Si(Li) for heavy metals (Sn, Ag etc)
- Advanced XRF algorithms for fast and accurate measurement and calibration (FP)
The Jordan Valley JVX 6200iF Galaxy is the tool of record for single bump composition measurements. It is an XRF tool that is ideal for non destructive, in-line µ-bump %Ag measurements. The system has a vertical excitation geometry that allows smallest beam footprint (<20µm FWHM @SnKα and AgKα) and no dependence on height variation. The tool provides information critical for good wafer level packaging process control. The JVX 6200iF comes with nEXT software which includes fully automated recipe driven measurements, FP analysis and advanced navigation algorithms allowing sub-micron centralization on single bump.
- µ-bumps (<20µm) Sn-Ag composition
- UBM and RDL multi layer analysis (Au, Cu, Ni, Pd, Ti )
- XRF: Vertical illumination/detection geometry with polycapillary optics for small spot (20µm FWHM)
JVX6200i Platform:
- Non destructive, production proven
- Fully 300/200mm fab automated, for high volume
- E84, EHT, SEC/GEM automation
- Certifications: S2/S8, CE , ISO9001, ISO14001, ISO18001
XRF
- Normal incidence micro spot XRF
- FWHM of <20µm, no dependence on height variation
- Si(Li) detectors , efficient for high energy photos
- Multiple detectors allow photon collection from a large solid angle, giving high throughput
- Superior efficiency for high energies (Such as AgKα and SnKα )
- Improved navigation techniques enable sub-micron navigation to single bump center
- Fully automated recipe driven measurements
