JVSensus
X-Ray Diffraction Imaging (XRDI) inspection system that detects crystalline defects in patterned and blanket wafers
- Identify cracks which will cause breakage BEFORE the breakage occurs
- Detect slip, which may cause overlay issues, on 300mm and 450mm wafers in minutes
- Patented, fully digital transmission topography system
- Full 450mm scanning, with rapid coarse transmission scans of either the whole wafer or selected regions
- Monitoring of defects down to single dislocations, a single atom or row wide (<1nm), at any doping and wafer backside treatment.
- Unique edge exclusion zone monitoring
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The JVSensus is the latest defect metrology system for Si device manufacturers. It helps identify problems encountered during wafer production using the latest X-ray diffraction imaging (XRDI) technology. Applications include monitoring edge damage to prevent costly wafer breakage during ultra fast anneal. It can qualify and monitor process tools at any technology node, which reduces cycle times and facilitates fab expansion.
- Si substrates
- Patterned wafer capability, even after metal layer deposition
- X-ray Diffraction Imaging in transmission and cross-section modes
- Full X-ray safety interlocks, fail-safe shutter and warning lamps
- Camera resolutions from ~10µm for high resolution work
- Survey in minutes at 75µm, optional high resolution review modes
- Automatic defect detection software, including KLARF outputs for review with factory ADC systems
