Wafer-Level Packaging Requirements Boost Orders for Jordan Valley Systems
Migdal Ha' Emek, Israel, May 01, 2007
May 01, 2007
High density, high pin count devices require film thickness and metals composition delivered by advanced metrology; multiple JVX 6200 systems have been shipped and qualified for production
Semiconductor metrology equipment manufacturer Jordan Valley Semiconductors announced that they have sold, installed and qualified multiple units of their JVX 6200 system to leading memory manufacturers for wafer-level packaging applications. The explosive growth in high density, high pin count devices that necessitate the more sophisticated types of packaging are now requiring advanced metrology.
The small pitch packages, with bumps spaced tightly together, require small spot and non-destructive techniques to measure film thickness and metals composition. The Jordan Valley JVX 6200 system enables accurate and precise characterization of the films used in wafer-level packaging and can measure the thickness and composition of the metals used in the Redistribution Layer (RDL), Under Bump Metallization (UBM), and lead-free solder alternatives.
Wafer-level packaging advantages
As consumer electronics continue to shrink in size and increase in features and functions, cell phones, laptops, cameras and other handheld devices are requiring new chip packages. Wafer-level packaging (WLP) offers the smallest package available (often the size of the actual chip), the lowest cost for electrical test and burn-in, and enhances device performance with its minimum length interconnects.
Common WLP processes include a final metallization layer used as an RDL that is often used in conjunction with an UBM. The UBM is critical for joint integrity because it:
- provides a surface that can be soldered,
- prevents diffusion to the IC, and
- exhibits low stress, excellent adhesion, and corrosion resistance.
Wafer-level packaging turns to advanced x-ray metrology
"This is an emerging market for our tool and a shift in how back-end metrology is accomplished,"commented Sean Jameson, VP of sales and marketing for Jordan Valley. "Typically, our metrology tools are primarily being used in fabs for in-line measurement of product wafers. Now, the new requirements for lead-free solder and wafer-level packaging have forced a movement to advanced small spot X-ray metrology. Traditional metrology is not effective with these newer, tighter pitch wafer-level packages and the measurements they require."
These advanced x-ray metrology systems were sold during the third and fourth quarters of 2006 and have since been installed and qualified in fabs in the United States and Asia Pacific.
Jordan Valley Semiconductors, Inc. provides semiconductor metrology solutions for thin films based on novel, rapid, non-contacting, and non-destructive x-ray technology. They offer a comprehensive family of solutions based on advanced X-Ray Reflectivity (XRR), X-Ray Fluorescence (XRF), and Small Angle X-Ray Scattering (SAXS) technologies (http://www.jvsemi.com/product.asp). These tools are fully automated, production ready, and ideal for both blanket and patterned wafers. Jordan Valley’s x-ray technology enables accurate and precise characterization of all film types, including single layers and multilayer stacks, high k and low k materials, metals and dielectrics, amorphous, poly-crystal and single crystal films.
Jordan Valley Semiconductors is the parent company of Jordan Valley Applied Radiation, Inc., which designs and manufactures bench top analyzers and advanced laboratory spectrometers for R&D;, QC, process control, and other applications. Jordan Valley’s primary shareholders are Elron Electronic Industries Ltd. (NASDAQ: ELRN) and Clal Industries and Investments Ltd. (TASE: CII). Research, development, and manufacturing are based in Migdal Ha'Emek, Israel. Applications engineering, customer support services, sales and marketing are located in Austin, Texas. http://www.jvsemi.com.
Company Contact: Sean Jameson, Jordan Valley Semiconductors Inc, 512-832-8470 or seanj@jvsemi.com
Agency Contact: Bruce Kirkpatrick, Kirkpatrick Communications, 925.244.9100 or brucekirk@kirk-com.com END