BedeScan™

Inspection system for surface and buried structural defects in patterned and blanket wafers

BedeScan™ helps identify problems encountered during wafer production using the latest X-ray diffraction imaging (XRDI) technology. Applications include monitoring buried defects to prevent costly wafer breakage during ultra fast anneal. It can qualify and monitor process tools at any technology node, including 90nm and below, which reduces cycle times and facilitates fab expansion. This system provides the most comprehensive crystallographic defect inspection solution for analyzing wafer quality in incoming wafers and during metallization steps.

ADVANTAGES

• Superior flexibility

  • rapid coarse scans of either the full wafer area or selected regions

• Optimized defect sensitivity

  • monitoring of defects down to single dislocations, a single atom or row wide (<1nm), at any doping and wafer backside treatment.

• Unique edge exclusion zone monitoring
• Real-time automated defect recognition

  • allows root-cause analysis, and identification of defective material at an early processing stage.

• Ease of-use

  • based on Windows platform combined with easy-to-use software

• Lowest cost of ownership

  • digital system cuts exposure times by an order-of-magnitude resulting in higher throughput and therefore the lowest CoO for X-ray metrology.

• Most advanced X-ray diffraction inspection available

  • patented Microsource X-ray generator

• Applications

  • Bare wafer inspection

  • IC manufacturing, patterned wafers

  • Fail proof determination of onset of relaxation