JVX6200 series

The JVX6200 Series Production-line proven X-ray metrology platform for FEOL, BEOL and WLP

jvx6200iThe JVX 6200 multichannel platform offers significant thin films metrology capabilities of opaque or transparent thin films with excellent track record of accuracy and repeatability, high uptime & low cost of ownership. The platform may include up to three metrology channels on a single system: XRR (X-Ray Reflectivity), XRF (X-Ray Fluorescence) or WAXRD (Wide angle X-ray diffraction) and SAXS (Small Angle X-Ray Scattering) for high-speed and non-destructive characterization of all film types. The platform support fully automated modern fabs. The JVX 6200 is utilized for advanced process control at the back-end of line (BEOL) and front end of line (FEOL) advanced processes of 70% of top 25 largest Semiconductor logic & memory fabs worldwide.The JVX6200i provide significant throughput improvements for demanding applications.

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ADVANTAGES

 

  • Fast X-ray Reflectance (XRR)
    • Capable of first principle independent thickness, density and roughness measurements of Thin film complex stacks
    • For FEOL (Metal gate & Hi-K: (Ti, TiN, Ta, TaN, Hf, HfO, HfSiO, LaO etc.)
    • For BEOL (Cu Seed/Barrier, cup etc.)
    • For special HDD multilayer stacks (>10 layer stack measured in <5sec)
    • Capable of product wafer measurement with small spot and accurate pattern recognition system
  • Micro-spot X-ray fluorescence (XRF)
    • Featured the smallest spot size available for product wafer measurement on 50um pads
    • Use multi-channel detectors for fast data acquisition.
  • Fast wide angel XRD (WAXRD)
    • Provide in-line fast metal metrology solution (Ta phase, Cu, W Grain size, and texture).

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