With each technology node, barrier layers are becoming increasingly thinner. One processing challenge is to deposit thinner, conformal barrier and seed layers over high-aspect ratio structures. With today’s fast XRR, barrier films can be characterized down to the 10Å level, which makes XRR uniquely qualified to characterize ultrathin Atomic Layer Deposition (ALD) barriers.

A single fast XRR measurement can deliver thickness, density and roughness information on a multi-layer stack of barrier and Cu seed as well as their interfacial layers in seconds per site.

Ultra thin barrier materials like this 20A ALD TaN can be quickly and accurately measured by the JVX 6200.