VUV700U
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Ultra Thin Films Metrology Tool

New vacuum Ultraviolet metrology for ultra thin film thickness and composition measurement, aquired by Jordan Valley from Metrosol in March 2010

The VUV700U is a state-of-the-art thin film measurement system challenging ultra thin film stacks for next-generation semiconductor notes.

The VUV700U is a proven technology for several critical applications.

Details

Jordan Valley’s state-of-the-art thin film measurement systems VUV700U is a powerful metrology for the upcoming challenging ultra thin films stacks of next-generation semiconductor nodes.
 VUV700U system also a proven technology for several critical applications for patterned imprint HDD Media manufacturing.
VUV700U short wavelength solution enables better and tighter process control on product wafers at a throughput suitable for high-volume manufacturing

Features

VUV technology is proven to be the most powerful optics based metrology for composition and ultra thin film thickness measurement.

  • The spectrum sensitivity to variation in thickness of ultra thin films is much higher in the longer wavelength range
  • The spectrum sensitivity to variation in composition is much higher in the DUV wavelength range due to the dramatic change of 'k' within this range.

Why VUV for Composition?

Applications

Composition & Thickness

  • Dielectrics: (SiON %N , ONO)
  • High-K gate: (HfOSi, Al2O3)
  • High-k capacitor (ZAZ, HAH)

Template Metrology: DTR (2D) and BPM (3D) RCW Model:

  • 3 fit parameters (pitch fixed):
    • Height
    • Top Width
    • Bottom Width
  • Sidewall Angle is calculated from the above information

 

Nanoimprint Metrology: DTR (2D) and BPM (3D) RCW Model:

  • 4 fit parameters (pitch fixed) for the resist material layer:
    • Height
    • RLT (residual layer thickness)
    • Top Width
    • Bottom Width
  • Sidewall Angle is calculated from the above information