Scanning HRXRD, XRR, WA-XRD for sub 20nm Si logic R&D, process development and production process monitoring on blanket and patterned wafers

JVX7300MThe JVX7300LMI was designed for in-fab R&D and in-line production process monitoring of semiconductors materials. It enables fully automated characterisation of many advanced materials in the semiconductor industry.

The standard configuration is the JVX7300L, which implements Scanning HRXRD, XRR, XRD, GI-XRD and WA-XRD.

Featuring fully automated source optics, the system can switch between standard XRD, High-Resolution, and X-ray reflectivity modes without user intervention, even within the same recipe batch. Full automation of the alignment, measurement, analysis and reporting of the results ensures productive and fast characterisation of thin films.

To allow in-plane XRD measurements, the optional I channel can be added.

For HRXRD of patterned structures, the M channel can be added. This allows the measurement of test structures on patterned wafers, with full pattern recognition.

The system can be used to characterise and monitor, amongst others,

  • III-V on Si for future node development
  • High-K thickness, density and crystallinity
  • FinFET characterization
  • MEMS structure analysis & characterization
  • Comprehensive analytical software suite for analysis, simulation & fit

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