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X-Ray Diffraction Imaging (XRDI) reflection inspection system that detects crystalline defects in patterned and blanket wafers
- Identify defects on wafers during manufacture without dislocation etching
- Identify defects on substrate surfaces and epilayers
- Patented, fully digital reflection topography system
- Full 300mm scanning, with rapid coarse reflection scans of either the full wafer area or selected regions
- Can mount part 450mm wafers
- Monitoring of defects down to single dislocations, a single atom or row wide (<1nm), at any doping and wafer backside treatment.
- Unique edge exclusion zone monitoring
- Capability for a wide range of crystalline substrates
- Efficient system with low power sources
The QC-RT is the latest defect metrology system. It uses reflection topography to image the surface and first 10-30µm subsurface region for crystalline defects.
- Si substrates and epi-layers
- Patterned wafer capability, even after metal layer deposition
- III-V, II-VI and IV-IV substrates
- SiC substrate and GaN epi-layers
- Thick substrates from end of boules to detemine slip penetration
- Full X-ray safety interlocks, fail-safe shutter and warning lamps
- Camera resolutions from 3μm for high resolution work
- Camera options for high resolution or high speed
- Microfocus generators running at 50W for low power consumption
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