A comprehensive suite of superior X-ray metrology tools High-volume semiconductor fabs worldwide rely on Jordan Valley's complete family of metrology solutions based on high-speed, non-destructive XRR, XRF, GI-SAXS and HRXRD technologies. The JVX 6200 and 6200i platforms, combined with Bede metrology solutions, set the standard in extendibility, versatility, and cost of ownership. And deliver unmatched speed, resolution and precision for all film types.
Bump Alloy Composition Void Detection Metals: Cu, Ti, Al, Ta, W, Alloys, etc. Dielectrics: Oxides, Nitrides, Poly, etc. High k and Low k Dielectrics Silicides: WSix, TiSix, CoSix, NiSix, etc. Magnetic RAM Multi-Layer Stacks Ultra-Thin Layers Down to 10Å Epi- and Poly-Si1-x Gex Stoichiometry WSix, TaOx Stoichiometry ONO, SiON, SiRN
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