Applications Overview

A comprehensive suite of metrology tools for virtually any application.

Advanced X-ray metrology solutions from Jordan Valley enable accurate and precise measurements for countless thin-film applications. Based on novel, rapid, non-contacting, and non-destructive X-ray technologies, these tools set the new standard in speed, precision and resolution required for today's high-volume fabs. Jordan Valley X-ray metrology systems deliver critical information on the thickness, composition and material structure of advanced semiconductor materials at 65nm and below.

Here are just a few of the applications that are well suited for Jordan Valley technology:

• Barrier & Seed Layers

  • Ta, TaN, TiN, Ti, Cu-Seed

• Interconnect Metals

  • W, Al, Cu (Plating, CMP, Etch)

• Strain Metrology

  • SiGe, Si:C, sSOI

• Hi-k & Metal Gate

  • Metal Gate + Hi-k, HfO, ZrO, ZAZ & TiZAZ

• UBM, RDL & Bumps

  • Ni/Cu/Pd, Ni/Cu/Au, Ag:Sn Bumps

• Thin Film Microstructure

  • Phase, Texture, Grain Size, Stress

• Silicides

  • NiSi, CoSi, WSi

• GMR, MRAM and HDD

  • MgO, CoFeB, Ru, Ta Stacks

• Crystalline Defect Inspection

  • Digital Strain Field Mapping

• Additional Applications