As interconnect dimensions shrink, accuracy requirements become increasingly difficult using in-line metrology. Non-destructive, small spot x-ray fluorescence (µ-XRF) can accurately measure copper interconnect thickness on various line space structures in the device area.
Thinning of copper lines becomes a roadblock as design rules shrink and more accurate measurement resolution is needed.
Measurements on copper pads are no longer sufficient, as they don't represent the structures used in the device.
JVX 6200 measures line/space structures for copper thickness and erosion.
Measuring copper thinning on different line/space structures on product is critical to controlling today's advanced interconnect processes as the erosion varies with line density.
Copper thickness, measured by Jordan Valley µ-spot XRF, correlates strongly with cross-sectional SEM data on a broad range of thicknesses and array structures.
Copper thickness, measured by Jordan Valley µ-spot XRF, correlates very strongly to sheet resistance on different patterned line/space structures.
