Additional Applications

  • Front End of Line (FEOL)

    • ONO

    • HAH or ZAZ

    • Organic ARCs

    • Advanced Resists

    • SOI

  • Back End of Line (BEOL)

    • Low k dielectrics

    • Aluminum processes

    • Flip Chip/Wafer level pack

    • Ohmic contacts

    • Memory applications

    • Process wafer inspection